ECE Colloquium: Rhonda Franklin (Minnesota)
Uniting Integration: Advancing RF Interconnects & Antenna-in-Package Technologies
High speed integration remains a challenge as mobile technologies demand use of multiple chips from different technologies to achieve performance and multi-functions from a variety of chip technologies in small form factor designs. High speed interconnects for devices operating into sub-millimeter wave frequencies are needed to facilitate the developing a united integration. Loss continues to be high concern especially in array applications that operate at very high frequencies. Antenna designers, on the other hand, for millimeter wave applications are exploring antenna-in-package concepts to achieve miniaturized antennas with good performance for cellular and IOT applications. Unfortunately, coupling between antenna elements is a chief concern, especially in small package sizes. The first part will introduce novel interconnects for three-dimensional integration that leverage the benefits of nanotechnology, namely nanowires, for applications ranging from millimeter wave to sub-terahertz frequencies. The second part of this presentation will discuss mm-wave antenna in a package for array applications that have improved isolation using substrates integrated waveguide and increased aperture efficiency using metamaterial approaches.
Bio:
Rhonda R. Franklin is the McKnight Presidential Endowed Professor in Electrical and Computer Engineering and Abbott Professor for Innovative Education in the Institute for Engineering and Medicine at the University of Minnesota. Her research investigates design of circuits, antennas, integration and packaging techniques, and characterization of electronic materials and magnetic nanomaterials. Her has co-authored 165 articles, six book chapters, and 12 patents/applications/licenses, with a primary focus on high-speed communications, biomedicine/nanomedicine, and ecology applications and engineering education with graduate (27 M.S. and Ph.D.) and undergraduate students (>34). For her research innovativeness she received the NSF Presidential Early Career Award at the start of her career. Over the years, her contributions to the advancement of packaging and interconnect research, broadening participation in engineering, and educating the next generation are recognition by receipt of IEEE MGA Diversity & Inclusion Award, IEEE N. Walter Cox Service Award, UMN College of Science and Engineering Service Award, IEEE MTT-S Distinguished Microwave Educator, and University of Michigan ECE Distinguished Educator Award. She is also a strong advocate for mentoring, developing co-developing programs like Project Connect to promote diversity and inclusivity in the RF/Microwave field and co-directing the UMN’s IEM Inspire program promote biomedical fields to youth and foster diversity. Currently, she is forming and directing an NSF Inclusive Mentoring Hub (M-FORCE) to Mentor the Formation of Research Careers in Engineering and welcomes collaborating with industry for mentors.